Taiwan Semiconductor Manufacturing Co (NYSE:TSM) will break ground next month in Dresden, Germany, for its first European plant.
C.C. Wei, Taiwan Semiconductor Chairman and CEO, will lead a delegation from the company and host equipment and material suppliers, clients, and government officials on August 20, Nikkei Asia reports.
As the Dresden plant is formally known, European Semiconductor Manufacturing Corp (ESMC) aims to commence operations by late 2027.
Several top chipmaking clients, including Infineon, Robert Bosch, and NXP Semiconductors NV (NASDAQ:NXPI), …